TPU Hot Melt Adhesive (HMA) Curing Masterbatch is a functional masterbatch designed to solve problems of TPU HMA such as slow curing speed, poor toughness of cured layers and difficulty in curing at low temperatures, and it focuses on two core goals: "precise control of curing efficiency" and "optimization of post-curing performance". This masterbatch uses low-crystallinity temperature-resistant TPU as its carrier, which has a melt flow rate (MFR) ranging from 10-15g/10min, and can well adapt to various types of hot melt adhesives including EVA-modified, POE-modified and pure TPU, while also effectively preventing component precipitation from affecting the performance of hot melt adhesives.
This masterbatch can achieve dual improvement of curing efficiency and adhesive layer performance, and is suitable for a variety of application scenarios. It maintains stable performance in the temperature range of 150-210℃, with an addition amount of only 4%-7%, and does not affect the initial tack and bonding strength of the hot melt adhesive, making it very suitable for automated production lines. In practical applications, it can be used in the packaging field to facilitate high-speed sealing and prevent adhesion; in the electronics field to help accurate positioning of components and improve vibration resistance; in the automotive field to ensure assembly efficiency in low-temperature environments; and also in the construction material field to achieve weather-resistant bonding and prevent falling off.
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